Title:
COMPONENT FOR SEMICONDUCTOR MANUFACTURING APPARATUS, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/010101
Kind Code:
A1
Abstract:
The present invention relates to a component for a semiconductor manufacturing apparatus, and a heat-resistant material, and the component for a semiconductor manufacturing apparatus, according to the present invention, has a level difference with a plurality of layers on a cross-section thereof, wherein the plurality of layers includes a first surface exposed to plasma and a second surface loaded on the semiconductor manufacturing apparatus.
Inventors:
KIM KI WON (KR)
Application Number:
PCT/KR2022/009578
Publication Date:
January 11, 2024
Filing Date:
July 04, 2022
Export Citation:
Assignee:
TOKAI CARBON KOREA CO LTD (KR)
International Classes:
H01J37/32; C23C16/44; H01L21/67
Foreign References:
| KR20200121642A | 2020-10-26 | |||
| KR20110033355A | 2011-03-31 | |||
| KR20190044260A | 2019-04-30 | |||
| KR20200008868A | 2020-01-29 | |||
| KR20180071747A | 2018-06-28 |
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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