Title:
COMPONENT PICKUP DEVICE, COMPONENT MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/254703
Kind Code:
A1
Abstract:
This component pickup device 13 is configured to position a support ring 23 having a through-hole 22 passing therethrough in the vertical direction and to pick up a component C from a component attachment sheet S that is stretched over an upper surface side of the support ring 23 so as to cover the through-hole 22. The component pickup device 13 includes an ejector 41 that moves inside the through-hole 22 of the support ring 23 and pushes the component C up from below the component attachment sheet S, a chuck head 51 that chucks and picks up the component C that has been pushed up by the ejector 41, an acquisition unit 53 that acquires information on or an image of the ejector 41, and a control unit 80. The control unit 80 acquires dimensions of the ejector 41 on the basis of the information on or the image of the ejector 41 acquired by the acquisition unit 53, and, on the basis of the acquired dimensions of the ejector 41 and the dimensions of the through-hole 22, controls the movement of the ejector 41 inside the through-hole 22 so as to avoid contact of the ejector 41 with the support ring 23.
Inventors:
KASUGA DAISUKE (JP)
Application Number:
PCT/JP2021/021405
Publication Date:
December 08, 2022
Filing Date:
June 04, 2021
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD (JP)
International Classes:
H01L21/52; H01L21/67; H05K13/02
Domestic Patent References:
| WO2015059749A1 | 2015-04-30 |
Foreign References:
| JP2012222054A | 2012-11-12 | |||
| JP2001230301A | 2001-08-24 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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