Title:
COMPONENT MOUNTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/075222
Kind Code:
A1
Abstract:
The present invention provides a component mounting apparatus comprising: a component recognition unit that performs component position recognition; an inspection unit that inspects whether or not a component can be mounted on a board mounting point; a first control unit that controls operations by the component recognition unit and the inspection unit; and a second control unit that executes a picking setup process to determine the allocation of each of a plurality of components to be picked by which one of a plurality of heads and the picking order of the plurality of components by the plurality of heads. The first control unit causes the component position recognition by the component recognition unit and the inspection of whether or not the component can be mounted by the inspection unit to be performed in parallel. The second control unit executes the picking setup process on the basis of the results of the component position recognition and the inspection as to whether or not mounting is possible which are performed in parallel.
Inventors:
KITADA YOSHIO (JP)
KASUGA DAISUKE (JP)
KASUGA DAISUKE (JP)
Application Number:
PCT/JP2022/037306
Publication Date:
April 11, 2024
Filing Date:
October 05, 2022
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD (JP)
International Classes:
H05K13/04
Foreign References:
| JP2003059955A | 2003-02-28 | |||
| JP2009004714A | 2009-01-08 | |||
| JP2018011025A | 2018-01-18 | |||
| JP6709900B2 | 2020-06-17 |
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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