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Title:
COMMUNICATION METHOD, COMMUNICATION DEVICE, AND COMMUNICATION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/127173
Kind Code:
A1
Abstract:
In this communication method, a plurality of BWPs are configured as a single BWP group for a prescribed operation, and the plurality of BWPs that are included in the BWP group are used to perform communication relating to the prescribed operation.

Inventors:
TAKANO HIROAKI (JP)
Application Number:
PCT/JP2022/015094
Publication Date:
July 06, 2023
Filing Date:
March 28, 2022
Export Citation:
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Assignee:
SONY GROUP CORP (JP)
International Classes:
H04W72/04; H04L27/26; H04W48/18; H04W76/10
Domestic Patent References:
WO2019092944A12019-05-16
Foreign References:
JP2021510979A2021-04-30
Other References:
HUAWEI, HISILICON: "Bandwidth part activation and adaptation", 3GPP DRAFT; R1-1717905, 3RD GENERATION PARTNERSHIP PROJECT (3GPP), MOBILE COMPETENCE CENTRE ; 650, ROUTE DES LUCIOLES ; F-06921 SOPHIA-ANTIPOLIS CEDEX ; FRANCE, vol. RAN WG1, no. Prague, Czech Republic; 20171009 - 20171013, 8 October 2017 (2017-10-08), Mobile Competence Centre ; 650, route des Lucioles ; F-06921 Sophia-Antipolis Cedex ; France , XP051341089
QUALCOMM INCORPORATED: "BW Reduction for RedCap UE", 3GPP DRAFT; R1-2104677, 3RD GENERATION PARTNERSHIP PROJECT (3GPP), MOBILE COMPETENCE CENTRE ; 650, ROUTE DES LUCIOLES ; F-06921 SOPHIA-ANTIPOLIS CEDEX ; FRANCE, vol. RAN WG1, no. e-Meeting; 20210510 - 20210527, 12 May 2021 (2021-05-12), Mobile Competence Centre ; 650, route des Lucioles ; F-06921 Sophia-Antipolis Cedex ; France , XP052010928
INTERDIGITAL, INC.: "Discussion on latency improvements for DL and DL+UL positioning methods", 3GPP DRAFT; R1-2104874, 3RD GENERATION PARTNERSHIP PROJECT (3GPP), MOBILE COMPETENCE CENTRE ; 650, ROUTE DES LUCIOLES ; F-06921 SOPHIA-ANTIPOLIS CEDEX ; FRANCE, vol. RAN WG1, no. e-Meeting; 20210510 - 20210527, 12 May 2021 (2021-05-12), Mobile Competence Centre ; 650, route des Lucioles ; F-06921 Sophia-Antipolis Cedex ; France , XP052011095
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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