Title:
COLLECTION DEVICE FOR LASER PROCESSING, LASER PROCESSING SYSTEM, AND LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/048469
Kind Code:
A1
Abstract:
In order to prevent the configuration of a laser irradiation unit from becoming complicated due to measures against scattering material generated during surface processing with laser light, a collection device 20 for laser processing comprises: a collection case 21 that is a case formed separately from a laser radiation unit 32 for irradiating a surface 5 to be processed with laser light L, and separating the surface 5 to be processed and the laser radiation unit 32 from each other during surface processing on land, the collection case 21 having an opening part 13 formed on one side thereof, being provided with transparent panels 11, 12 facing the opening part 13, and, in an installation state in which the opening part 13 is closed and the surface 5 to be processed is covered, enabling surface processing in which the laser light L from the laser radiation unit 32 irradiates the surface 5 to be processed through the transparent panels 11, 12; and a suction device 22 that sucks air inside the collection case 21 in the installation state to thereby suck scattering material generated during surface processing.
More Like This:
Inventors:
HIRAYAMA TAKEO (JP)
SAMBA KAZUNORI (JP)
HOSODA TAKESHI (JP)
SAMBA KAZUNORI (JP)
HOSODA TAKESHI (JP)
Application Number:
PCT/JP2023/030820
Publication Date:
March 07, 2024
Filing Date:
August 25, 2023
Export Citation:
Assignee:
JAPANESE PULSE LASER DEV ASSOCIATION (JP)
International Classes:
B08B5/00; B23K26/142; B23K26/16; B23K26/36
Domestic Patent References:
| WO2021075534A1 | 2021-04-22 |
Foreign References:
| JP2007175721A | 2007-07-12 | |||
| JP2014210290A | 2014-11-13 | |||
| JP2020040115A | 2020-03-19 |
Attorney, Agent or Firm:
OIKE Bunpei (JP)
Download PDF: