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Patent Searching and Data


Title:
COATING LAYER REMOVAL METHOD AND COATING LAYER REMOVAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/058133
Kind Code:
A1
Abstract:
This coating layer removal method includes: a step for delivering, from a first roll (1), a first laminated film (50) having a first base film and a first coating layer; a step for delivering a second film (e.g., second laminated film (50A)) from a second roll (1A); a step for causing a surface of the first laminated film (50) on the side of the first coating layer to face one surface of the second film, and bringing the surfaces into contact with each other; a step for stretching the first laminated film (50) and the second film; a step for releasing the contact between the surfaces; a step for removing the first coating layer by immersing the contact-released first laminated film (500) into process water (HW) inside a water tank (32); and a first winding step for winding up the first base film (51), wherein the first coating film includes a first intermediate layer and a first release agent layer.

Inventors:
FUKAYA TOMOMI (JP)
NISHIO TAKATOSHI (JP)
MORI YUICHI (JP)
ISAWA YUTA (JP)
Application Number:
PCT/JP2023/033076
Publication Date:
March 21, 2024
Filing Date:
September 11, 2023
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
B29B17/02; B32B38/18
Foreign References:
JP2004363140A2004-12-24
JPS5720319A1982-02-02
JPS58118212A1983-07-14
KR100728481B12007-06-13
JP2019209511A2019-12-12
JP2002265665A2002-09-18
JP2011104986A2011-06-02
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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