Title:
CO-PACKAGED OPTICS STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/077908
Kind Code:
A1
Abstract:
The present application relates to the technical field of chip packaging, and discloses a co-packaged optics structure and a manufacturing method therefor. The method comprises: providing a redistributed layer which is integrated with an optical waveguide layer on one side; flipping and molding a first photoelectric integrated chip and a second photoelectric integrated chip on the optical waveguide layer side of the redistributed layer, wherein the first photoelectric integrated chip performs optical signal transmission with the second photoelectric integrated chip by means of the optical waveguide layer, and the first photoelectric integrated chip and the second photoelectric integrated chip are connected to flip pads of the redistributed layer; and performing ball planting on the ball planting pad side of the redistributed layer. The first photoelectric integrated chip communicates with the second photoelectric integrated chip by means of the optical waveguide layer, and uses high bandwidth of optical transmission, so that the transmission rate of the chips is effectively improved; and the complex line in a packaged structure is simplified.
Inventors:
ZHU KAI (CN)
HUANG LIXIANG (CN)
SHAO GUANGJUN (CN)
HUANG LIXIANG (CN)
SHAO GUANGJUN (CN)
Application Number:
PCT/CN2023/087987
Publication Date:
April 18, 2024
Filing Date:
April 13, 2023
Export Citation:
Assignee:
SHENNAN CIRCUITS CO LTD (CN)
International Classes:
H01L25/16; H01L21/56; H01L21/60; H01L23/31; H01L23/48; H01L23/488
Foreign References:
| CN112086445A | 2020-12-15 | |||
| CN112086444A | 2020-12-15 | |||
| US20040150081A1 | 2004-08-05 | |||
| CN113053835A | 2021-06-29 | |||
| US20190393171A1 | 2019-12-26 |
Attorney, Agent or Firm:
SHENZHEN ZHONGDING INTELLECTUAL PROPERTY AGENCY (CN)
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