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Title:
CLEANING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/083019
Kind Code:
A1
Abstract:
The present invention relates to a cleaning composition, which specifically comprises: an alkaline compound, an alcohol amine, a corrosion inhibitor, a chelating agent and a solvent. The positive effects thereof lie in that residues left on a surface of a wafer after CMP can be effectively removed; moreover, the composition does not corrode copper interconnectors and low-k materials; and the composition has a large operation window, and has wide application prospects in post-CMP cleaning of semiconductors.

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Inventors:
ZHANG WEIPENG (CN)
LIU BING (CN)
ZHAO PENG (CN)
PENG HONGXIU (CN)
Application Number:
PCT/CN2023/124130
Publication Date:
April 25, 2024
Filing Date:
October 12, 2023
Export Citation:
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Assignee:
ANJI MICROELECTRONICS TECH SHANGHAI CO LTD (CN)
International Classes:
C11D1/62; C11D3/20; C11D3/28; C11D3/30; C11D3/33; C11D3/34; C11D3/60; C11D11/00; H01L21/02
Domestic Patent References:
WO2002065538A22002-08-22
WO2006107475A12006-10-12
WO2015116818A12015-08-06
Foreign References:
CN101233221A2008-07-30
CN110004449A2019-07-12
CN113151838A2021-07-23
CN113186036A2021-07-30
CN113186540A2021-07-30
CN113186541A2021-07-30
CN113186543A2021-07-30
CN113249175A2021-08-13
CN1906287A2007-01-31
Attorney, Agent or Firm:
BEIJING DACHENG LAW OFFICES, LLP (CN)
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