Title:
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2024/035111
Kind Code:
A1
Abstract:
A circuit board according to an embodiment comprises an insulating layer and an electrode part disposed in the insulating layer, the electrode part comprising: a first electrode; a second electrode disposed on the first electrode; and first and second via electrodes disposed between the first and second electrodes, wherein the first via electrode is connected to the first and second electrodes, and the length of the second via electrode in the vertical direction is smaller than the length of the first via electrode in the vertical direction.
Inventors:
HEO SEONG HO (KR)
KIM SUNG MIN (KR)
KIM SUNG MIN (KR)
Application Number:
PCT/KR2023/011746
Publication Date:
February 15, 2024
Filing Date:
August 09, 2023
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L23/498; H01L23/00; H01L23/15; H05K1/11; H05K1/18
Foreign References:
| KR20160144103A | 2016-12-16 | |||
| KR20110054853A | 2011-05-25 | |||
| KR20110032522A | 2011-03-30 | |||
| KR20190071345A | 2019-06-24 | |||
| KR20210050106A | 2021-05-07 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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