Title:
CIRCUIT BOARD MODULE AND ELECTRONIC APPARATUS INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2024/072042
Kind Code:
A1
Abstract:
An electronic device according to one embodiment of the present disclosure may comprise: a housing; a circuit board disposed in the housing; a first component and a second component disposed on one surface of the circuit board; a shielding mold disposed on the one side of the circuit board to cover the top and side surfaces of the first component; and an open structure which is disposed on the one surface of the circuit board and surrounds the side surface of the second component. In the open structure, the top portion may be open to expose a portion of the circuit board or the second component, an inner surface may be spaced apart from the second component, and an outer surface may be in contact with the shielding mold.
Inventors:
JEON JINHWAN (KR)
JUNG KWANGHO (KR)
CHO CHIHYUN (KR)
HA SANGWON (KR)
JUNG KWANGHO (KR)
CHO CHIHYUN (KR)
HA SANGWON (KR)
Application Number:
PCT/KR2023/014911
Publication Date:
April 04, 2024
Filing Date:
September 26, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K9/00; G02B27/01; H05K1/11; H05K3/28; H05K3/34
Foreign References:
| KR20200110289A | 2020-09-23 | |||
| KR20180032985A | 2018-04-02 | |||
| KR20200003050A | 2020-01-08 | |||
| KR20190129650A | 2019-11-20 | |||
| KR20120005376A | 2012-01-16 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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