Title:
CIRCUIT BOARD MANUFACTURING PROCESS, SYSTEM, AND MICRO DIAMETER END MILL
Document Type and Number:
WIPO Patent Application WO/2022/140909
Kind Code:
A1
Abstract:
The present invention provides a circuit board manufacturing process, a system, and a micro diameter end mill, which are used for manufacturing a flex-rigid bonding plate. The flex-rigid bonding plate comprises a flex plate and a rigid plate. The process comprises: applying at least one micro diameter end mill to cut a rigid plate, so as to form a connection groove; using the connecting groove to connect the flex plate and the rigid plate, wherein the traveling speed of the micro diameter end mill is greater than or equal to 0.05 m/min, and the traveling speed of the micro diameter end mill is less than or equal to 0.5 m/min, and wherein the traveling speed of the micro diameter end mill is greater than or equal to 50000 r/min, and the rotation speed of the micro diameter end mill is less than or equal to 110000 r/min. Using a specific micro diameter end mill instead of a laser to cut a rigid plate can facilitate controlling the cutting strength easier, so that a rigid plate is more stably cut, without causing the carbonization of the rigid plate, thereby improving the cutting quality.
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Inventors:
XIA YUANHONG (CN)
Application Number:
PCT/CN2020/140136
Publication Date:
July 07, 2022
Filing Date:
December 28, 2020
Export Citation:
Assignee:
SHENZHEN YAXINHONGDA ELECTRONIC TECH CO LTD (CN)
International Classes:
H05K1/14; B23C5/10; B26D3/06
Foreign References:
| CN105228343A | 2016-01-06 | |||
| CN111295040A | 2020-06-16 | |||
| CN202045394U | 2011-11-23 | |||
| CN105642983A | 2016-06-08 | |||
| CN202162433U | 2012-03-14 | |||
| US20080145158A1 | 2008-06-19 |
Attorney, Agent or Firm:
HENSEN INTELLECTUAL PROPERTY FIRM (CN)
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