Title:
CIRCUIT BOARD, DIGITAL ISOLATOR OR TRANSFORMER, AND METHOD FOR MANUFACTURING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/210317
Kind Code:
A1
Abstract:
This circuit board comprises a core, a base insulation layer, a first and a second coil part, and first through fourth wiring. The core is formed of a magnetic material and has a thickness of 10 μm to 300 μm. The base insulation layer is provided around the core. The first coil part and the second coil part are wound around the core with the base insulation layer therebetween. The first wiring and the second wiring are connected to the first coil part. The third wiring and the fourth wiring are connected to the second coil part.
Inventors:
INOUE MASAMI (JP)
YAMAZAKI HIROSHI (JP)
ISHII JUN (JP)
TAKANO TAKAHIRO (JP)
ICHIMARU SHUHEI (JP)
YAMAZAKI HIROSHI (JP)
ISHII JUN (JP)
TAKANO TAKAHIRO (JP)
ICHIMARU SHUHEI (JP)
Application Number:
PCT/JP2023/014499
Publication Date:
November 02, 2023
Filing Date:
April 10, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01F30/10; H01F17/04; H05K1/02; H05K1/16
Foreign References:
| JP2017028064A | 2017-02-02 | |||
| JP2018046181A | 2018-03-22 | |||
| JP2005223129A | 2005-08-18 | |||
| JPH10154795A | 1998-06-09 | |||
| JP2013527620A | 2013-06-27 |
Attorney, Agent or Firm:
NAKAGAWA, Masahiro et al. (JP)
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