Title:
CIRCUIT BOARD DAMPING MECHANISM AND VEHICLE-MOUNTED APPARATUS USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/280204
Kind Code:
A1
Abstract:
Disclosed in the present application are a circuit board damping mechanism and a vehicle-mounted apparatus using same. The mechanism is used for fixing a circuit board having a through hole to a base plate, and the damping mechanism comprises: an assembly plate, the assembly plate being fixedly arranged on the base plate; a fixing bolt, the fixing bolt comprising a nut and a stud, wherein the stud passes through the through hole to cooperate with the nut to fix the circuit board onto the assembly plate; and a damping washer, the damping washer being arranged between the circuit board and the nut of the fixing bolt. In the present application, a bearing ring portion of a damping rubber ring bears the main weight of a circuit board; and when an apparatus shakes longitudinally, the bearing ring portion and the damping washer at an upper portion form a vertical buffer structure; moreover, the elasticity of the rubber ring itself is utilized to tightly press against the circuit board under the action of the fixing bolt, thereby buffering a longitudinal impact on the circuit board while preventing the circuit board from vertically shaking.
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Inventors:
FU BINGKAI (CN)
Application Number:
PCT/CN2022/104120
Publication Date:
January 12, 2023
Filing Date:
July 06, 2022
Export Citation:
Assignee:
SHANGHAI YUXING ELECTRONICS TECH CO LTD (CN)
International Classes:
F16F15/08; F16B5/02; H05K7/14
Foreign References:
| CN113531039A | 2021-10-22 | |||
| JP2019107959A | 2019-07-04 | |||
| CN103899513A | 2014-07-02 | |||
| CN108397498A | 2018-08-14 |
Attorney, Agent or Firm:
BEIJING LEAP INTELLECTUAL PROPERTY AGENCY LTD. (CN)
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