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Title:
CHEMICAL-MECHANICAL POLISHING COMPOSITION AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/085009
Kind Code:
A1
Abstract:
The present invention provides a chemical-mechanical polishing composition with which it is possible to polish a molybdenum film and a silicon dioxide film at a stable polishing rate, and suppress corrosion of the molybdenum film.　A chemical-mechanical polishing composition according to the present invention contains: abrasive grains (A); an iron(III) compound (B); and at least one type of metal atom selected from the group consisting of Al atoms, Mn atoms, and Zn atoms. The total Al, Mn, and Zn atom content is 0.1 ppm to 100 ppm, inclusive.

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Inventors:
ISHIMAKI KOKI (JP)
YAMAGUCHI MISATO (JP)
Application Number:
PCT/JP2022/038749
Publication Date:
May 19, 2023
Filing Date:
October 18, 2022
Export Citation:
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Assignee:
JSR CORP (JP)
International Classes:
H01L21/304; B24B37/00; C01B33/141; C09G1/02; C09K3/14
Foreign References:
JP2020174083A2020-10-22
JP2004235317A2004-08-19
JP2019172733A2019-10-10
JP2021509768A2021-04-01
JP2015525483A2015-09-03
Attorney, Agent or Firm:
OFUCHI, Michie et al. (JP)
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