Title:
CHEMICAL-MECHANICAL POLISHING COMPOSITION AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/085007
Kind Code:
A1
Abstract:
The present invention provides a chemical-mechanical polishing composition with which it is possible to polish a molybdenum film at a stable polishing rate, and suppress corrosion of the molybdenum film. A chemical-mechanical polishing composition according to the present invention contains abrasive grains (A) and an iron(III) compound (B), wherein the nitric acid ion concentration in the chemical-mechanical polishing composition is 200 ppm or less.
Inventors:
ISHIMAKI KOKI (JP)
YAMAGUCHI MISATO (JP)
YAMAGUCHI MISATO (JP)
Application Number:
PCT/JP2022/038747
Publication Date:
May 19, 2023
Filing Date:
October 18, 2022
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
H01L21/304; B24B37/00; C01B33/141; C09G1/02; C09K3/14
Foreign References:
| JP2014504441A | 2014-02-20 | |||
| JP2004235317A | 2004-08-19 | |||
| JP2019172733A | 2019-10-10 | |||
| JP2021509768A | 2021-04-01 | |||
| JP2015525483A | 2015-09-03 |
Attorney, Agent or Firm:
OFUCHI, Michie et al. (JP)
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