Title:
CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/176594
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a heat-resistant, humidity-resistant, and highly reliable ceramic electronic component by, in a plating step for forming an external electrode, preventing a plating solution from intruding into a base electrode layer. This ceramic electronic component 1 comprises: a ceramic base body that includes an internal electrode layer; and an external electrode which is disposed on the surface of said ceramic base body and is electrically connected to the internal electrode layer. The ceramic electronic component is characterized in that the external electrode 3 comprises: a base electrode layer 4 containing a SiO2-BaO-B2O3-CaO-based glass; a protective layer 5 that covers the surface of the SiO2-BaO-B2O3-CaO-based glass which is exposed on the surface of said base electrode layer, the protective layer containing at least one element selected from the group consisting of P, S, C, Si, Ba, F, N, Al, Sr and B; and a Ni plating layer 6a that covers the base electrode layer and the protective layer.
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Inventors:
IKEBE SYOUTA (JP)
NISHISAKA YASUHIRO (JP)
NISHISAKA YASUHIRO (JP)
Application Number:
PCT/JP2023/008612
Publication Date:
September 21, 2023
Filing Date:
March 07, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/30
Domestic Patent References:
| WO2020241122A1 | 2020-12-03 |
Foreign References:
| JP2007242706A | 2007-09-20 | |||
| JP2020072246A | 2020-05-07 | |||
| JP2004100014A | 2004-04-02 | |||
| JPS6451613A | 1989-02-27 |
Attorney, Agent or Firm:
KATO Ryuta et al. (JP)
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