Title:
CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2024/070485
Kind Code:
A1
Abstract:
This ceramic electronic component comprises a multilayer chip and a pair of external electrodes and is characterized in that: the multilayer chip has an approximately rectangular parallelepiped shape and is formed of a plurality of dielectric layers and a plurality of internal electrode layers that are stacked in alternation between two cover layers for which a ceramic is the main component, wherein the plurality of internal electrode layers are alternately exposed at opposing first and second end faces of said approximately rectangular parallelepiped shape; the pair of external electrodes are disposed at the first end face and the second end face and have a plating layer disposed on an underlayer; each of the pair of external electrodes extends to at least either of an upper surface and lower surface of the multilayer chip considered in the stacking direction; and the cover layers contain at least one additive element from among elements that form a covalent hydride.
Inventors:
KITAMURA SHOHEI (JP)
SHIROTA AYUMI (JP)
MATSUOKA AYUMI (JP)
ASAKO HIKARI (JP)
SHIROTA AYUMI (JP)
MATSUOKA AYUMI (JP)
ASAKO HIKARI (JP)
Application Number:
PCT/JP2023/031873
Publication Date:
April 04, 2024
Filing Date:
August 31, 2023
Export Citation:
Assignee:
TAIYO YUDEN KK (JP)
International Classes:
H01G4/30
Foreign References:
| JP2022075550A | 2022-05-18 | |||
| JP2013098525A | 2013-05-20 | |||
| JP2021009994A | 2021-01-28 | |||
| JP2013120927A | 2013-06-17 |
Attorney, Agent or Firm:
KATAYAMA, Shuhei (JP)
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