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Patent Searching and Data


Title:
CELL CULTURE METHOD USING TEMPERATURE-RESPONSIVE MICROCARRIER, AND BEADS FOR TEMPERATURE-RESPONSIVE CELL CULTURE
Document Type and Number:
WIPO Patent Application WO/2024/075722
Kind Code:
A1
Abstract:
The present invention provides: a method for culturing adhesive cells using a microcarrier coated with a polymer that exhibits a lower critical temperature within a culture vessel, wherein the method is characterized by including the following steps (1) to (4): (1) a step that cultures the cells on the microcarrier surface in a culture broth of a temperature at or above the lower critical temperature; (2) a step that, after step (1), cools the culture broth to or below the lower critical temperature; (3) a step that, after step (2), stirs the culture broth in the culture vessel, and detaches the cells from the microcarrier surface; and (4) a step that, after step (3), recovers the cells detached from the microcarrier surface; and temperature-responsive beads composed of a carrier and a polymer coat film comprising a temperature-responsive polymer having a lower critical solution temperature of 0°C to 50°C, wherein the carrier surface has a positive charge and the film thickness of the temperature-responsive polymer is 10 nm to 1000 nm.

Inventors:
HIRATOKO SHOYA (JP)
NEZU YUSUKE (JP)
IMATOMI SHINYA (JP)
ITO HIROYUKI (JP)
Application Number:
PCT/JP2023/036049
Publication Date:
April 11, 2024
Filing Date:
October 03, 2023
Export Citation:
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Assignee:
TOSOH CORP (JP)
International Classes:
C12N5/07; C08J3/12; C12M1/00; C12M3/00; C12N1/02; C12N5/00; C12N5/071; C12N5/0735; C12N5/074; C12N5/0775; C12N5/0789; C12N5/0797
Domestic Patent References:
WO2012029877A12012-03-08
Foreign References:
JP2021159049A2021-10-11
JP2021114995A2021-08-10
JP2020110140A2020-07-27
JP2019126326A2019-08-01
Other References:
"JIS How To Series - New Edition: Points for Selecting Plastic Materials. 2nd Edition", 2003, JAPANESE STANDARDS ASSOCIATION, ISBN: 4-542-30396-9, pages: 436 - 437
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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