Title:
BULK ACOUSTIC WAVE FILTER AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/087400
Kind Code:
A1
Abstract:
The present application relates to a bulk acoustic wave filter and a manufacturing method therefor. The manufacturing method for the bulk acoustic wave filter of the present application comprises the following steps: determining designed thicknesses of corresponding piezoelectric layers according to designed frequencies of a first resonator to an nth resonator, wherein n≥2; forming, on a wafer substrate, air cavities of the first resonator to the nth resonator, sacrificial layers, seed layers, bottom electrode layers, and piezoelectric layers having a thickness of T; trimming the thicknesses of the piezoelectric layers of the first resonator to the nth resonator to the designed thicknesses by using Ar+ ion beams, so as to form piezoelectric layers having different thicknesses of the first resonator to the nth resonator; forming top electrode layers on the trimmed piezoelectric layers of the first resonator to the nth resonator; and releasing the sacrificial layers to obtain the bulk acoustic wave filter. According to the manufacturing method for the bulk acoustic wave filter of the present application, filters having different frequencies can be manufactured on the same wafer, and the area of a chip can be greatly reduced when the filters having different frequencies are integrated.
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Inventors:
LI GUOQIANG (CN)
Application Number:
PCT/CN2023/071393
Publication Date:
May 02, 2024
Filing Date:
January 09, 2023
Export Citation:
Assignee:
HEYUAN AIFO LIGHT COMMUNICATION TECH CO LTD (CN)
International Classes:
H03H3/02; H03H9/02
Attorney, Agent or Firm:
SL INTELLECTUAL PROPERTY CO., LTD. (CN)
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