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Patent Searching and Data


Title:
BUBBLE PUNCTURING DEVICE OF COMPOUND MACHINE
Document Type and Number:
WIPO Patent Application WO/2024/082549
Kind Code:
A1
Abstract:
The present application relates to the technical field of bubble puncturing devices, and in particular to a bubble puncturing device of a compound machine, comprising a rack, a needling guide roller rotatably connected to the rack, and a press roller rotatably connected to the rack. A plurality of needling rings are fixed to the outer wall of the needling guide roller, a fixing frame is slidably connected to a side wall of the rack, the needling guide roller is rotatably connected to the fixing frame, and a driving assembly used for driving the fixing frame to slide is arranged on the rack. The present application has the effects that the shape and number of tool marks acting on a copy paper board are standardized, and the possibility of leaking bubbles into a finished product is reduced.

Inventors:
XIANG LEI (CN)
LIU WEI (CN)
ZHU LIGANG (CN)
TANG LONG (CN)
ZHAO GUOYU (CN)
WU CHAO (CN)
Application Number:
PCT/CN2023/083656
Publication Date:
April 25, 2024
Filing Date:
March 24, 2023
Export Citation:
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Assignee:
SHANGHAI ZIJIANG METALLIZATION ENVIRONMENTAL PROT MATERIAL CO LTD (CN)
International Classes:
B32B37/00
Foreign References:
CN115519876A2022-12-27
CN215038153U2021-12-07
CN216031306U2022-03-15
CN217201275U2022-08-16
JPH11254396A1999-09-21
Attorney, Agent or Firm:
SHANGHAI YUTENG PATENT AGENCY (GENERAL PARTNERSHIP) (CN)
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