Title:
BREADBOARD
Document Type and Number:
WIPO Patent Application WO/2019/175969
Kind Code:
A1
Abstract:
Provided is a breadboard that does not require a jumper wire. This breadboard is provided with a terminal connection layer and a wiring layer. The terminal connection layer comprises: a plurality of conductive regions which are electrically connected and each of which is insulated from the others; a plurality of terminal attachment/detachment parts that connect the conductive regions to terminals; and contacts that are electrically connected to the respective conductive regions. The terminal attachment/detachment parts are provided on a first surface and the contacts are provided on a second surface that differs from the first surface. The wiring layer can be physically separated from the terminal connection layer, includes wiring lines that are electrically connected to the contacts, and electrically connects at least any two of the plurality of insulated conductive regions through the contacts and the wiring lines.
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Inventors:
SANO HAJIME (JP)
ISHII YASUHIRO (JP)
KOMATSU YOSHIKAZU (JP)
ADACHI KOSUKE (JP)
ISHII YASUHIRO (JP)
KOMATSU YOSHIKAZU (JP)
ADACHI KOSUKE (JP)
Application Number:
PCT/JP2018/009754
Publication Date:
September 19, 2019
Filing Date:
March 13, 2018
Export Citation:
Assignee:
TOSHIBA KK (JP)
International Classes:
H05K1/02; G01R31/28; G09B23/18; H01R11/01
Foreign References:
| JPH039282A | 1991-01-17 | |||
| JP2014212152A | 2014-11-13 | |||
| JP3211092U | 2017-06-22 | |||
| JP2004517362A | 2004-06-10 | |||
| JP2009122638A | 2009-06-04 |
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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