Title:
BONDING PART, MULTI-PLATE CLUTCH DEVICE PROVIDED WITH SAID BONDING PART, AND MANUFACTURING METHOD OF BONDING PART
Document Type and Number:
WIPO Patent Application WO/2021/079533
Kind Code:
A1
Abstract:
Provided are a bonding part, a multi-plate clutch device provided with the bonding part, and a manufacturing method of the bonding part, wherein the bonding part has fine recesses capable of suppressing a decrease in flatness of a metallic base body such as a core to which a to-be-bonded object such as a friction material is to be bonded. In a friction plate (200) as a bonding part, countless fine recesses (204) are formed in a bonding surface (203) of a core (201), to which a friction material (207) is to be bonded. The bonding surface (203) is formed in a ring shape along the circumferential direction of the core (201) and has a flatness of 0.15 mm or less. The fine recesses (204) are formed such that fine recesses (204) adjacent to each other on the bonding surface (203) do not overlap each other and the formation density per unit area (Ua) within the bonding surface 203 is uniform. The fine recesses (204) are laser processing marks formed by irradiating the core (201) with laser light L.
Inventors:
YAMASHITA AKIHIRO (JP)
MORIMOTO KYOHEI (JP)
HOSODA TATSUKI (JP)
REN XINGYU (JP)
MORIMOTO KYOHEI (JP)
HOSODA TATSUKI (JP)
REN XINGYU (JP)
Application Number:
PCT/JP2019/043296
Publication Date:
April 29, 2021
Filing Date:
November 05, 2019
Export Citation:
Assignee:
FCC KK (JP)
International Classes:
F16D69/04; F16D13/62
Domestic Patent References:
| WO2015040706A1 | 2015-03-26 |
Foreign References:
| JPH10299798A | 1998-11-10 | |||
| JP2015502255A | 2015-01-22 | |||
| JPH09324824A | 1997-12-16 | |||
| JPH0614572U | 1994-02-25 | |||
| JP2018200114A | 2018-12-20 | |||
| JPH03505620A | 1991-12-05 |
Attorney, Agent or Firm:
ITO Hiroyuki (JP)
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