BONDING METHOD

WIPO Patent Application WO/2020/208879

A1

The present invention is characterized by including a bonding step in which: a rotating rotary tool (F) is inserted from only a surface (10a) side of an auxiliary member (10); and in a state where only a stirring pin (F2) is brought into contact with the auxiliary member (10), the base end side of the stirring pin (F2) is left exposed, and the outer peripheral surface of the stirring pin (F2) is brought into slight contact with a first metal member (1) and a second metal member (2), the rotary tool (F) is moved relatively along butted parts (J1, J2) to bond the first metal member (1) and the second metal member (2) together via the auxiliary member (10). The present invention is also characterized in that: the auxiliary member (10) comprises, on at least one side surface thereof, an inclined surface that tapers going away from the surface (10a); and the first metal member (1) and/or the second metal member (2) comprises an inclined surface (end surface 1a, 2a) which inclines from the front surface to the rear surface in accordance with the inclined surface of the auxiliary member (10).

JPH02229685	MANUFACTURE OF SELF-DRILL SCREW
WO/2019/053571	AREA SPECIFIC METALLIC FOAMS BY FRICTION STIR PROCESSING
WO/2019/140869	FRICTION STIR WELDING APPARATUS AND FRICTION STIR WELDING SYSTEM COMPRISING THE SAME

SEO NOBUSHIRO (JP)
OIKAWA KEITA (JP)
YOSHIDA RYO (JP)

PCT/JP2019/050708

October 15, 2020

December 24, 2019

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NIPPON LIGHT METAL CO (JP)

B23K20/12

WO2016132768A1

2016-08-25

US20030075584A1	2003-04-24
JP2000094159A	2000-04-04
JP2003039183A	2003-02-12
JP2018008306A	2018-01-18
JP2007083242A	2007-04-05

See also references of EP 3954491A4

ISONO INTERNATIONAL PATENT OFFICE, P.C. (JP)

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