Title:
BONDING METHOD AND BONDING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/189192
Kind Code:
A1
Abstract:
A bonding method comprises: measuring at least one of management dimensions that affect dimensions of a member to be obtained by bonding a first member and a second member having a bonding insertion portion into which the first member is inserted; determining, according to the measured management dimension, relative positions for positioning the first member and the second member by inserting the first member into the bonding insertion portion; heating the second member up to a first temperature; putting the first member and the second member in the relative positions by inserting the first member into the bonding insertion portion; and maintaining the first member and the second member in the relative positions by stopping the heating of the second member. Thus, a bonding method is provided that bonds a first member and a second member together to yield a bonded member with high accuracy in terms of a longitudinal dimension of the bonded member.
Inventors:
FUJIMOTO TAKAAKI (JP)
SHIMIZU TOMOKAZU (JP)
SHIMIZU TOMOKAZU (JP)
Application Number:
PCT/JP2020/007519
Publication Date:
September 24, 2020
Filing Date:
February 25, 2020
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
B23P11/02; F16B4/00
Foreign References:
| US20060049180A1 | 2006-03-09 | |||
| JP2002046029A | 2002-02-12 | |||
| JP2017222000A | 2017-12-21 | |||
| JPS59159409A | 1984-09-10 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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