Title:
BONDED BODY, MANUFACTURING METHOD OF BONDED BODY, AND BUFFER
Document Type and Number:
WIPO Patent Application WO/2023/017722
Kind Code:
A1
Abstract:
A solenoid case material is filled in a second annular groove, forming a second bond, and thereafter, a solenoid case material is filled in a first annular groove, forming a first bond. By this means, part of the load acting on the piston rod when the solenoid case material flows into the first annular groove can be received by the second bond, so it is possible to reduce the reaction force in the piston rod, and to prevent the upper end of the piston rod from being deformed due to the reaction force received by the piston rod.
Inventors:
HIGUMA MASATO (JP)
KOSHIZAKA ATSUSHI (JP)
KAWAHARA KEIJI (JP)
ISHIMARU YU (JP)
KOSHIZAKA ATSUSHI (JP)
KAWAHARA KEIJI (JP)
ISHIMARU YU (JP)
Application Number:
PCT/JP2022/028430
Publication Date:
February 16, 2023
Filing Date:
July 22, 2022
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
B21D39/00; F16B4/00; F16F9/32
Foreign References:
| JP2001054268A | 2001-02-23 | |||
| JP2008055483A | 2008-03-13 | |||
| JP2009202193A | 2009-09-10 | |||
| JP2013212531A | 2013-10-17 |
Attorney, Agent or Firm:
YAMAMOTO, Osamu et al. (JP)
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