Title:
BOARD INSPECTION DEVICE AND BOARD INSPECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/170990
Kind Code:
A1
Abstract:
Provided is a board inspection device or the like which can more accurately specify an area occupied by an adhesive. A captured image is acquired by capturing an image of at least an area on which the adhesive is spread on the board. In addition, a central part area of the adhesive is specified in the captured image and, by means of a specific technique that is different from a specific technique for the central part area, a skirt part area of the adhesive positioned around the central part area is specified in the captured image. Then, the entire area Ajs of the adhesive is specified on the basis of the specified central part area and skirt part area. In order to individually specify, by means of different specific techniques, the central part area and the skirt part area of which the optical characteristics are different from each other, both areas are precisely specified, and thus the area (the entire area Ajs) occupied by the adhesive is more accurately specified. As a result, the preciseness pertaining to quality determination for the adhesive becomes more improved.
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Inventors:
KIKUCHI KAZUYOSHI (JP)
OBATA TAKUYA (JP)
OBATA TAKUYA (JP)
Application Number:
PCT/JP2022/025577
Publication Date:
September 14, 2023
Filing Date:
June 27, 2022
Export Citation:
Assignee:
CKD CORP (JP)
International Classes:
G01N21/956; H05K3/00
Foreign References:
| JPH06334319A | 1994-12-02 | |||
| JP2018182070A | 2018-11-15 | |||
| JP2003080143A | 2003-03-18 | |||
| JP2002139452A | 2002-05-17 | |||
| JP2020204487A | 2020-12-24 |
Attorney, Agent or Firm:
KAWAGUCHI Mitsuo (JP)
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