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Patent Searching and Data


Title:
BOARD DIVIDING JIG
Document Type and Number:
WIPO Patent Application WO/2023/136103
Kind Code:
A1
Abstract:
A board dividing jig (100, 200) is a jig for dividing a board (40) having a first dividing line (42). The board dividing jig comprises: a base plate unit (10) including a first base plate (11) and second base plate (12) which are disposed adjacent to one another in a first direction (DR1); and a first board pressing unit (20) and a second board pressing unit (30). A first boundary (13), which is a boundary between the first base plate and the second base plate, extends in a second direction (DR2) orthogonal to the first direction. The first base plate includes a first surface (11a) and a second surface (11b), which is the opposite surface to the first surface. The second base plate includes a third surface (12a) and a fourth surface (12b), which is the opposite surface to the third surface. The board is placed on the first surface and the third surface such that the first dividing line faces the first boundary.

Inventors:
SASAKI SHUNSUKE (JP)
TANABE TSUYOSHI (JP)
KURIHARA TAKUMI (JP)
HAMADA WAKAKI (JP)
Application Number:
PCT/JP2022/047700
Publication Date:
July 20, 2023
Filing Date:
December 23, 2022
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B26F3/00; H05K3/00
Foreign References:
JPH03221400A1991-09-30
JPH0740296A1995-02-10
JPH0843282A1996-02-16
JPS6334103A1988-02-13
JPH0330395A1991-02-08
JPH0278504A1990-03-19
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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