Title:
BACKING MATERIAL FOR ULTRASONIC PROBE, METHOD FOR MAKING SAME, AND ULTRASONIC PROBE
Document Type and Number:
WIPO Patent Application WO/2022/138175
Kind Code:
A1
Abstract:
A backing material for an ultrasonic probe according to the present invention comprises a carbonaceous matrix that has communicating holes distributed in said matrix, and a resin with which the communicating holes are filled.
Inventors:
YAMADA KUNITAKA (JP)
OHNO TOSHIKI (JP)
OHNO TOSHIKI (JP)
Application Number:
PCT/JP2021/045197
Publication Date:
June 30, 2022
Filing Date:
December 08, 2021
Export Citation:
Assignee:
MITSUBISHI PENCIL CO (JP)
International Classes:
H04R17/00; A61B8/00; H04R31/00
Domestic Patent References:
| WO2011148618A1 | 2011-12-01 |
Foreign References:
| JP2019193151A | 2019-10-31 | |||
| JP2015221214A | 2015-12-10 | |||
| JP2016219662A | 2016-12-22 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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