Title:
ATTACHMENT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/153005
Kind Code:
A1
Abstract:
The present invention enables attachment according to the differences in the thickness of an attachment part. This attachment structure includes a first member (1) and a second member (2) that are attached to a ceiling interior member (10) (attachment part 10) by sandwiching the ceiling interior member (10) in the thickness direction. The first member (1) is provided with a fixing part (1C) for fixing the second member (2). The second member (2) has a plurality of joining parts (2A, 2B, 2C) that join with the fixing part (1C) of the first member (1) and that are provided at different heights in the thickness direction of the ceiling interior member (10).
Inventors:
WATANABE KENTARO (JP)
Application Number:
PCT/JP2022/032926
Publication Date:
August 17, 2023
Filing Date:
September 01, 2022
Export Citation:
Assignee:
JVCKENWOOD CORP (JP)
International Classes:
F16B5/02; F16B5/06; H05K7/12
Foreign References:
| JP2015014346A | 2015-01-22 | |||
| CN205858873U | 2017-01-04 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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