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Title:
ATTACHMENT DEVICE AND ATTACHMENT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/153362
Kind Code:
A1
Abstract:
An attachment device (1) is attached to an attached body (2). The attached body (2) has a plurality of surface areas (90A) on a surface (90). The plurality of surface areas (90A) include a first surface area (91) and a second surface area (92), which face in different directions. The attachment device (1) comprises a main body (10A) that can bring about a covering state in which both the first surface area (91) and the second surface area (92) are covered. The device is provided with a suction assembly (12) having a plurality of suction legs (80) that can exert suction on the attached body (2). A first suction leg (81), which is one of the plurality of suction legs (80), extends from the main body (10A) in the covering state toward the first surface area (91) and suctions to the first surface area (91). A second suction leg (82), which is one of the plurality of suction legs (80), extends from the main body (10A) in the covering state toward the second surface area (92) and suctions to the second surface area (92).

Inventors:
TSUJII EIICHIRO (JP)
KAWASUMI MAKOTO (JP)
SHIMIZU HIDEYUKI (JP)
HOSHIYA EISUKE (JP)
Application Number:
PCT/JP2023/003787
Publication Date:
August 17, 2023
Filing Date:
February 06, 2023
Export Citation:
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Assignee:
SHINMEI IND CO LTD (JP)
International Classes:
F16M13/02; F16B47/00; F16M13/00
Foreign References:
JP2003062771A2003-03-05
JP2001170882A2001-06-26
JP2000135692A2000-05-16
JP2008068750A2008-03-27
JPH10118582A1998-05-12
JP2004195637A2004-07-15
Attorney, Agent or Firm:
OKADA PATENT & TRADEMARK OFFICE, P. C. (JP)
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