Title:
ATTACHMENT DEVICE, ELECTRONIC DEVICE, ATTACHMENT DEVICE SECURING METHOD, AND SHEET
Document Type and Number:
WIPO Patent Application WO/2018/116877
Kind Code:
A1
Abstract:
Provided is an attachment device which makes it easy to attach an electronic device body to a wall surface. The attachment device is an attachment device for attaching an electronic device body to a wall surface and provided with: a base portion including a plurality of pin holes; a plurality of pins which are respectively passed through the plurality of pin holes, and which secure the base portion onto the wall surface; and a latch portion which is secured to the base portion, and onto which the electronic device body is latched. The base portion has a securing surface that is a surface to be secured to the wall surface. Each of the plurality of pin holes is disposed at a predetermined angle toward the outside of the base portion with respect to the securing surface.
Inventors:
KAWAGUCHI SATOSHI
TANIGUCHI AKIRA
TANIGUCHI AKIRA
Application Number:
PCT/JP2017/044293
Publication Date:
June 28, 2018
Filing Date:
December 11, 2017
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H05K5/02; F16M13/02; G09F9/00; H04N5/64; F16B45/00
Foreign References:
JPH11184395A | 1999-07-09 | |||
JPS6278181U | 1987-05-19 | |||
JP2014077450A | 2014-05-01 | |||
JP2006313220A | 2006-11-16 | |||
JPS53147610U | 1978-11-20 | |||
JPH10232050A | 1998-09-02 | |||
JP2002106955A | 2002-04-10 | |||
JP2011149453A | 2011-08-04 | |||
JPS551866B2 | 1980-01-17 |
Other References:
See also references of EP 3557958A4
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
Download PDF:
Previous Patent: CYLINDRICAL NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY
Next Patent: GASKET AND SEALING STRUCTURE
Next Patent: GASKET AND SEALING STRUCTURE