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Title:
ASSEMBLY APPARATUS
Document Type and Number:
WIPO Patent Application WO/2010/100814
Kind Code:
A1
Abstract:
Provided is an assembly apparatus in which a predetermined amount of grease can be certainly applied to and a predetermined number of balls can be certainly mounted on ball race portions formed at opposite ends of a head pipe. An assembly apparatus for applying grease (3) and mounting balls (4) to and on ball race portions (2) formed at opposite ends of a head pipe (1) comprises an upper head portion (5) and a lower head portion (6), which hold therebetween opposite ends of the head pipe (1), a ball feed means (7) for arranging and holding a predetermined number of balls (4) in the head portions (5, 6), a grease discharge means (8) for discharging a predetermined amount of grease (3) to the vicinities of the ball race portions (2) from the respective head portions (5, 6), and a ball discharge means (9) for extruding the grease (3) discharged from the grease discharge means (8) through the balls (4) arranged and held by the ball feed means (7) and for mounting the balls (4) and the grease (3) on the ball race portions (2) at the opposite ends of the head pipe (1).

Inventors:
YAMABE SHIGEKI (JP)
ARAKI TAKAYUKI (JP)
NISHIDA YUKIO (JP)
Application Number:
PCT/JP2010/000183
Publication Date:
September 10, 2010
Filing Date:
January 14, 2010
Export Citation:
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Assignee:
HONDA MOTOR CO LTD (JP)
YAMABE SHIGEKI (JP)
ARAKI TAKAYUKI (JP)
NISHIDA YUKIO (JP)
International Classes:
B23P21/00; B23P19/02; F16C43/06; F16N11/08
Foreign References:
JPS57132820U1982-08-19
JPS58149419A1983-09-05
JPH06277954A1994-10-04
JPH08323557A1996-12-10
JPH10118858A1998-05-12
JP2002242948A2002-08-28
JPH042423A1992-01-07
Attorney, Agent or Firm:
KOYAMA, YUU (JP)
Tamotsu Koyama (JP)
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