APPARATUS FOR WELDING PIPES FOR SEMICONDUCTOR PROCESS

WIPO Patent Application WO/2023/243947

A1

An apparatus for welding pipes for a semiconductor process according to the present invention comprises: a grip module that independently grips and fixes first and second pipes to be welded; a welding module that is provided on the outside and welds a connection between the first pipe and the second pipe; and a fixing module that includes a first fixing unit, a second fixing unit, and a support unit. The first fixing unit is inserted into the first pipe and configured such that at least a portion thereof can contract and expand within the first pipe and selectively comes into contact with the inner surface of the first pipe. The second fixing unit is configured to be spaced a certain distance from the first fixing unit, is disposed inside the separate second pipe, and is configured to be able to contract and expand such that at least a portion thereof selectively comes into contact with the inner surface of the second pipe. The support unit is formed lengthwise such that the first and second fixing units are arranged spaced apart from each other on portions thereof along the longitudinal direction, and independently adjusts the contraction and expansion of the first and second fixing units. One end of the support unit in the longitudinal direction passes through the inside of at least one of the first pipe or the second pipe and is located inside the other pipe.

CHOI GWAN (KR)
MUN SIK (KR)

PCT/KR2023/007955

December 21, 2023

June 09, 2023

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GUNJEEENG CO LTD (KR)

B23K37/053; B23K37/04; F16L13/02; B23K101/04

JP2008212994A	2008-09-18
JPH0737482U	1995-07-11
JPH0542393A	1993-02-23
JPH06344140A	1994-12-20
KR20000006927A	2000-02-07
KR102471129B1	2022-11-25
KR102471134B1	2022-11-25
KR102471150B1	2022-11-25

KO, Young Kap (KR)

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