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Patent Searching and Data


Title:
APPARATUS, METHOD, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2021/201187
Kind Code:
A1
Abstract:
Provided is an apparatus that assists with molding of a resin, the apparatus comprising: a prediction unit that generates a probability distribution for prediction values of to-be-analyzed characteristics of a resin molded article, the prediction values corresponding to the values of a plurality of molding factors in the molding of the resin; and a display processing unit that executes a display process for causing a display device to display the probability distribution for the prediction values of the to-be-analyzed characteristics. When the value of at least one molding factor among the plurality of molding factors in the molding of the resin has changed within a predetermined range, the prediction unit calculates a change in the distribution for the prediction values of the to-be-analyzed characteristics, and the display unit displays the change in the probability distribution for the prediction values of the to-be-analyzed characteristics.

Inventors:
KIMURA IPPEI (JP)
MORITA TATSUYA (JP)
Application Number:
PCT/JP2021/014073
Publication Date:
October 07, 2021
Filing Date:
March 31, 2021
Export Citation:
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Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
B29C45/76
Foreign References:
JPH0435923A1992-02-06
JP2006123172A2006-05-18
Other References:
See also references of EP 4129621A4
Attorney, Agent or Firm:
RYUKA IP LAW FIRM (JP)
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