ALLOY MATERIAL FOR PROBE PINS - ISHIFUKU METAL IND

Title:

ALLOY MATERIAL FOR PROBE PINS

Document Type and Number:

WIPO Patent Application WO/2023/189160

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide an alloy material for probe pins that makes it possible to suppress diffusion of components of a probe material and solder at a circuit connection part which is to be tested when a probe test is performed.　This alloy material for probe pins is composed of more than 20 mass% to no more than 60 mass% of Pd, at least 3 mass% to less than 20 mass% of Ag, 3-50 mass% of Ni, and 3-74 mass% of Cu. Alternatively, the alloy material for probe pins is composed of more than 20 mass% to no more than 60 mass% of Pd, 20-35 mass% of Ag, 7-50 mass% of Ni, and 3-53 mass% of Cu.

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Inventors:

HASEGAWA KOICHI (JP)
EGAWA YASUNORI (JP)
MATSUZAWA ATSUO (JP)
SATO KENICHI (JP)

Application Number:

PCT/JP2023/007737

Publication Date:

October 05, 2023

Filing Date:

March 02, 2023

Export Citation:

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Assignee:

ISHIFUKU METAL IND (JP)
YOKOWO SEISAKUSHO KK (JP)

International Classes:

C22C5/04; C22C9/00; C22C9/06; C22C19/03; C22C30/02; C22F1/00; C22F1/08; C22F1/10; C22F1/14; G01R1/06

Domestic Patent References:

WO2013099682A1	2013-07-04
WO2016159316A1	2016-10-06

Foreign References:

JP2004093355A	2004-03-25
JP3574139B2	2004-10-06
JPS5482343A	1979-06-30
US6210636B1	2001-04-03

Attorney, Agent or Firm:

TOMITA Yoshimi (JP)

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