Title:
AL WIRING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/168789
Kind Code:
A1
Abstract:
Provided is an Al wiring material with which the joined reliability of a joint under high-temperature environments during the operation of a semiconductor device can be sufficiently obtained. An Al wiring material contains at least one among Pd and Pt, with the balance comprising Al, wherein: when the content of Pd is x1a [mass ppm] and the content of Pt is x1b [mass ppm], 3≤x1a≤90 or 10≤x1b≤250 is satisfied and 3≤(x1a＋x1b)≤300 is satisfied; and the average crystal grain diameter in a cross section perpendicular to the longitudinal direction of the Al wiring material is 3-35 μm.
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Inventors:
UNO TOMOHIRO (JP)
SUTO YUYA (JP)
OYAMADA TETSUYA (JP)
ODA DAIZO (JP)
KURIHARA YUTO (JP)
ETO MOTOKI (JP)
SUTO YUYA (JP)
OYAMADA TETSUYA (JP)
ODA DAIZO (JP)
KURIHARA YUTO (JP)
ETO MOTOKI (JP)
Application Number:
PCT/JP2022/003584
Publication Date:
August 11, 2022
Filing Date:
January 31, 2022
Export Citation:
Assignee:
NIPPON MICROMETAL CORP (JP)
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
International Classes:
C22C21/00; C22F1/00; C22F1/04; H01L21/60
Foreign References:
| JP2014224283A | 2014-12-04 | |||
| JPS6132444A | 1986-02-15 | |||
| JPS6095948A | 1985-05-29 | |||
| JPS60177667A | 1985-09-11 | |||
| JP2008311383A | 2008-12-25 | |||
| JP2014129578A | 2014-07-10 | |||
| JP2002314038A | 2002-10-25 | |||
| JP2016511529A | 2016-04-14 | |||
| JP2016152316A | 2016-08-22 | |||
| JP2014129578A | 2014-07-10 | |||
| JP2002246542A | 2002-08-30 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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