Title:
ADSORPTION SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2024/080280
Kind Code:
A1
Abstract:
An adsorption substrate according to the present disclosure has a substrate, a conductive layer and a projecting section. The substrate has insulative properties. The substrate has a first surface that holds a processing target, and a second surface located on the side thereof opposite the first surface. The conductive layer is positioned inside the substrate. The projecting section has conductive properties. The projecting section projects from the conductive layer toward the second surface. The projecting section extends in a direction parallel to the first surface. The projecting section has a tapered shape in which the width of the cross-section which is perpendicular to the direction of extension thereof becomes narrower in a direction toward the second surface, or has a rectangular shape in which said width is uniform.
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Inventors:
FUJIO KAZUHIKO (JP)
ITO MASAKI (JP)
ITO MASAKI (JP)
Application Number:
PCT/JP2023/036765
Publication Date:
April 18, 2024
Filing Date:
October 10, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L21/683; H02N13/00
Domestic Patent References:
| WO2022085307A1 | 2022-04-28 | |||
| WO2019208625A1 | 2019-10-31 |
Foreign References:
| JP2006210696A | 2006-08-10 | |||
| JP2003179128A | 2003-06-27 | |||
| JP2009141344A | 2009-06-25 | |||
| JP2015162481A | 2015-09-07 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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