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Title:
ADHESIVE SHEET AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/063123
Kind Code:
A1
Abstract:
Provided is a novel method for facilitating the detachment of an element after processing and enhancing productivity when manufacturing an electronic component or a semiconductor device.　An object to be processed used for manufacturing an electronic component or a semiconductor device is stuck to a recesses-and protrusions surface of an adhesive layer. A processed product is obtained by performing a process on the object to be treated on the adhesive layer. The processed product is detached from the adhesive layer.

Inventors:
NISHIJIMA KENTA (JP)
ONISHI GO (JP)
SUGINO TAKASHI (JP)
Application Number:
PCT/JP2023/034244
Publication Date:
March 28, 2024
Filing Date:
September 21, 2023
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; C09J7/38; H01L21/56; H01L21/683
Foreign References:
JP2019176154A2019-10-10
JP2018511006A2018-04-19
JP2020015196A2020-01-30
Attorney, Agent or Firm:
OHTSUKA PATENT OFFICE, P.C. (JP)
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