Title:
ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION STRUCTURE, AND METHOD OF PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2023/195398
Kind Code:
A1
Abstract:
An adhesive film for circuit connection comprises: a resin composition containing a thermoplastic resin, a radically polymerizable compound, and a radical polymerization initiator; and conductive particles, wherein a cyclopolymerizable monomer is contained as the radically polymerizable compound.
Inventors:
IWAMOTO SHINNOSUKE (JP)
KUDO SUNAO (JP)
KUDO SUNAO (JP)
Application Number:
PCT/JP2023/012839
Publication Date:
October 12, 2023
Filing Date:
March 29, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C09J9/02; C09J4/00; C09J7/30; C09J11/04; C09J11/06; C09J175/14; C09J201/00; H01R11/01
Domestic Patent References:
| WO2005121266A1 | 2005-12-22 | |||
| WO2023276889A1 | 2023-01-05 |
Foreign References:
| KR20090059319A | 2009-06-11 | |||
| JP2022050067A | 2022-03-30 | |||
| JP2022003367A | 2022-01-11 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: