Title:
ADHESIVE COMPOSITION FOR CONNECTING SEMICONDUCTOR CIRCUIT, AND ADHESIVE FILM COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2020/085770
Kind Code:
A1
Abstract:
The present invention relates to: a polymer compound having a particular structure, comprising an acrylic resin with a functional group that can mutually form a hydrogen bond with an acrylic resin with imidazole; an adhesive resin composition for a semiconductor, comprising a thermoplastic resin, a thermosetting resin, a curing agent, and the polymer compound having a particular structure; and an adhesive film for a semiconductor, manufactured by using same.
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Inventors:
KIM YOUNGSAM (KR)
KIM JUNGHAK (KR)
KIM JU HYEON (KR)
LEE KWANG JOO (KR)
KIM JUNGHAK (KR)
KIM JU HYEON (KR)
LEE KWANG JOO (KR)
Application Number:
PCT/KR2019/013905
Publication Date:
April 30, 2020
Filing Date:
October 22, 2019
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C07D403/12; C09D163/00; C09J7/00; C09J11/06; C09J201/00; H01L21/67
Foreign References:
| CN104231157A | 2014-12-24 | |||
| US20090111930A1 | 2009-04-30 | |||
| JP2002194057A | 2002-07-10 |
Other References:
HEINZMANN, C. ET AL: "Supramolecular polymer adhesives: advanced materials inspired by nature", CHEMICAL SOCIETY REVIEWS, vol. 45, no. 2, 2016, pages 342 - 358, XP055708887
YAMAUCHI, K.: "Thermoreversible Poly(alkyl acrylates) Consisting of Self-Complementary Multiple Hydrogen Bonding", MACROMOLECULES, vol. 36, no. 4, 2003, pages 1083 - 1088, XP002260387, DOI: 10.1021/ma0212801
See also references of EP 3763709A4
YAMAUCHI, K.: "Thermoreversible Poly(alkyl acrylates) Consisting of Self-Complementary Multiple Hydrogen Bonding", MACROMOLECULES, vol. 36, no. 4, 2003, pages 1083 - 1088, XP002260387, DOI: 10.1021/ma0212801
See also references of EP 3763709A4
Attorney, Agent or Firm:
YOU ME PATENT AND LAW FIRM (KR)
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