Title:
ADDITION-CURABLE MOLD-RELEASING SILICONE COMPOSITION FOR SILICONE ADHESIVE, RELEASE FILM, AND RELEASE PAPER
Document Type and Number:
WIPO Patent Application WO/2024/080229
Kind Code:
A1
Abstract:
The present invention is an addition-curable mold-releasing silicone composition for a silicone adhesive, the composition comprising: (A) a fluorine-containing organopolysiloxane which has at least two alkenyl groups and at least one fluorine-containing substituent and has at least one aryl group and/or at least one aralkyl group, and in which the fluorine content is 25-50 mass%, the ratio of the total number of the aryl group and the aralkyl group to the total number of monovalent substituents is 0.1-20 mol%, and the area of a component having a molecular weight of at most 4,000 in a molecular weight distribution measurement is 2-20% of the entire peak area; (B) an organohydrogen polysiloxane which has at least three SiH groups; (C) a platinum group metal-based catalyst; and (D) a non-fluorine-based solvent. Consequently, provided is a silicone composition which is for a mold releasing agent, can be diluted with a non-fluorine-based solvent, has high coatability and adhesiveness with respect to a film base material, and has a low peel force when evaluated by a transfer method, and from which a cured film with a small reduction in a residual adhesive force is formed.
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Inventors:
OGIKUBO SHUNYA (JP)
YASUDA HIROYUKI (JP)
YASUDA HIROYUKI (JP)
Application Number:
PCT/JP2023/036460
Publication Date:
April 18, 2024
Filing Date:
October 06, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C09D183/08; B32B27/00; C09D5/00; C09D5/38; C09D7/20; C09D183/05; C09D183/07; C09J7/40; C09K3/00; D21H27/00
Foreign References:
| JP2014196462A | 2014-10-16 | |||
| CN112979954A | 2021-06-18 | |||
| JPS6474268A | 1989-03-20 | |||
| JP2020100763A | 2020-07-02 | |||
| JP2022114930A | 2022-08-08 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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