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Title:
ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/061944
Kind Code:
A1
Abstract:
Provided is an active light sensitive or radiation sensitive resin composition which contains (A) a resin that contains a repeating unit (a) represented by general formula (1), (B) a compound that generates an acid upon irradiation of active light or radiation, and (C) an organic solvent. This active light sensitive or radiation sensitive resin composition has a solid content concentration of 4% by mass or less. (In the formula, each of R11 and R12 independently represents a hydrogen atom, a halogen atom or a monovalent organic group; R13 represents a hydrogen atom, a halogen atom or a monovalent organic group, or alternatively represents a single bond or an alkylene group, which forms a ring by being bonded to L or Ar in the formula; L represents a single bond or a divalent linking group; Ar represents an aromatic ring group; and n represents an integer of 2 or more.)

Inventors:
TSUBAKI HIDEAKI (JP)
FURUTANI HAJIME (JP)
KANEKO AKIHIRO (JP)
NIHASHI WATARU (JP)
HIRANO SHUJI (JP)
Application Number:
PCT/JP2017/033951
Publication Date:
April 05, 2018
Filing Date:
September 20, 2017
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/038; G03F7/039
Domestic Patent References:
WO2017115629A12017-07-06
WO2015178375A12015-11-26
Foreign References:
JP2014041326A2014-03-06
JPH08337616A1996-12-24
JP2000267280A2000-09-29
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Other References:
ACS NANO, vol. 4, no. 8, pages 4815 - 4823
See also references of EP 3521926A4
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
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