Title:
2.5D MODULE STRUCTURE WITH SIX-SIDE PROTECTION AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/082532
Kind Code:
A1
Abstract:
The present invention relates to a 2.5D module structure with six-side protection, comprising an adapter plate; conductive silicon through holes, which pass through the adapter plate and are electrically connected to pads and a redistribution layer; the pads, which are located on the back face of the adapter plate; solder balls, which are connected to the pads; the redistribution layer, which is located on the front face of the adapter plate and is electrically connected to bumps; the bumps, which are located on the front face of the adapter plate; dry films, which cover side faces of the adapter plate; chips, which are arranged on the front face of the adapter plate; a first underfill layer, which is located between the chips and the adapter plate; an encapsulation layer, which encapsulates the chips; a substrate, which is connected to the solder balls; and a second underfill layer, which is located between the substrate and the adapter plate. The present invention further relates to a manufacturing method for the 2.5D module structure with six-side protection. The 2.5D module structure with six-side protection achieves all-around protection for 2.5D modules while hardly increasing manufacturing procedures and costs, thereby improving the reliability of modules.
Inventors:
ZHANG CHUNYAN (CN)
SUN PENG (CN)
SUN PENG (CN)
Application Number:
PCT/CN2023/081843
Publication Date:
April 25, 2024
Filing Date:
March 16, 2023
Export Citation:
Assignee:
NAT CENTER FOR ADVANCED PACKAGING CO LTD (CN)
International Classes:
H01L25/07; H01L23/48
Foreign References:
| CN112908948A | 2021-06-04 | |||
| CN110676240A | 2020-01-10 | |||
| CN115547998A | 2022-12-30 | |||
| CN102034718A | 2011-04-27 | |||
| CN114256194A | 2022-03-29 | |||
| US20140312475A1 | 2014-10-23 |
Attorney, Agent or Firm:
SHANGHAI ZHISHENG INTELLECTUAL PROPERTY OFFICE (CN)
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