Title:
ばね装置
Document Type and Number:
Japanese Patent JP7401722
Kind Code:
B2
Abstract:
To provide a spring device which is high in degree of freedom of a layout by dispensing with a member penetrating a leaf spring group.SOLUTION: A spring device comprises; a first structure 1 having a first end plate 11, a pipe-shaped member 12 attached to the first end plate 11 at a base end, and a lid plate 13 attached to a tip of the pipe-shaped member 12 and formed with an opening part 13a; a second end plate 3; a piston member 4 attached to the second end plate 3, and in slide-contact therewith so as to be movable in an axial direction at the inside of the opening part 13a of the lid plate 13; a second structure 2 having a first tensile plate 21 locked to the piston member 4 when a tensile force acts on the piston member and moving while separating from the piston member when a compression force acts on the piston member, and a second tensile plate 22 connected to the first tensile plate 21 via a plurality of pieces of bolts 23 so as to be variable in distance with the lid plate 13 and movable in the pipe-shaped member 12; and a leaf spring group 5 arranged inside the bolts 23 at the inside of the pipe-shaped member 12.SELECTED DRAWING: Figure 6
Inventors:
Masafumi Yamamoto
Yousuke Suzuki
Natsuki Iino
Shusaku Maeda
▲ケイ▼ 超
Toru Kato
Daichi Shioya
Futoshi Ishizuka
Yousuke Suzuki
Natsuki Iino
Shusaku Maeda
▲ケイ▼ 超
Toru Kato
Daichi Shioya
Futoshi Ishizuka
Application Number:
JP2020004337A
Publication Date:
December 20, 2023
Filing Date:
January 15, 2020
Export Citation:
Assignee:
TAKENAKA CORPORATION
Heiwa Hatsujo Co., Ltd.
Heiwa Hatsujo Co., Ltd.
International Classes:
F16F1/32; F16F3/02
Domestic Patent References:
| JP2013104438A | ||||
| JP47015544A | ||||
| JP53057185U | ||||
| JP2012163134A | ||||
| JP4075693U | ||||
| JP6613443B1 |
Foreign References:
| CN106382315A |
Attorney, Agent or Firm:
Osamu Mori