Title:
感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法
Document Type and Number:
Japanese Patent JP7018168
Kind Code:
B2
Abstract:
To provide a photosensitive resin composition having excellent adhesion strength with plated copper and showing excellent resolution and adhesiveness to a substrate made of a silicon raw material such as a silicon wafer and to a chip component, and a dry film, a printed wiring board and a method for manufacturing a printed wiring board using the above composition.SOLUTION: The photosensitive resin composition comprises (A) an acid-modified vinyl group-containing epoxy resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a silane compound, in which the content of the (D) inorganic filler is 20 to 60 mass% based on a total solid content of the photosensitive resin composition. A dry film, a printed wiring board and a method for manufacturing a printed wiring board using the above composition are also disclosed.SELECTED DRAWING: None
Inventors:
Kenichi Iwashita
Takako Ejiri
Akihiro Nakamura
Masayuki Kojima
Nobuhito Furumuro
Shinji Irisawa
Takako Ejiri
Akihiro Nakamura
Masayuki Kojima
Nobuhito Furumuro
Shinji Irisawa
Application Number:
JP2015249943A
Publication Date:
February 10, 2022
Filing Date:
December 22, 2015
Export Citation:
Assignee:
Showa Denko Materials Co., Ltd.
International Classes:
G03F7/027; G03F7/004; G03F7/075; H05K1/03; H05K3/28
Domestic Patent References:
| JP2013104013A | ||||
| JP2015031849A | ||||
| JP2011164270A | ||||
| JP2014199414A | ||||
| JP5564144B2 | ||||
| JP2012242592A |
Attorney, Agent or Firm:
Otani Ho
Kenichi Hirasawa
Yosuke Sawayama
Kenichi Hirasawa
Yosuke Sawayama