Title:
電磁波減衰フィルム
Document Type and Number:
Japanese Patent JP7231089
Kind Code:
B2
Abstract:
To provide an electromagnetic wave attenuating film that can attenuate a radio wave with a frequency in a millimeter wave band, the electromagnetic wave attenuating film being thin and excellent in environment resistance such as weatherability and heat resistance.SOLUTION: The present invention is an electromagnetic wave attenuating film comprising a dielectric substrate having a front face and a back face, a thin-film conductive layer arranged on the front face, and a flat-plate inductor or a laminated layer arranged on the back face. A top coat layer composed of resin material may be provided on the thin-film conductive layer. The thin-film conductive layer includes a plurality of metal plates. When the thickness and the skin depth of the metal plate are T and d, respectively, the following formula is satisfied in a frequency band of 35 GHz-50 GHz. -2.0≤ln(T/d)≤-0.5.SELECTED DRAWING: Figure 7
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Inventors:
Atsuko Aoki
Shinpei Kondo
Shinpei Kondo
Application Number:
JP2022055012A
Publication Date:
March 01, 2023
Filing Date:
March 30, 2022
Export Citation:
Assignee:
Toppan Printing Co., Ltd.
International Classes:
H01Q17/00; H05K9/00
Domestic Patent References:
| JP2007073662A | ||||
| JP2005012204A | ||||
| JP7193387A | ||||
| JP2001156491A |
Foreign References:
| CN110972459A | ||||
| CN206807974U | ||||
| CN208029314U |
Attorney, Agent or Firm:
Patent Attorney Corporation Daiichi International Patent Office
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