Title:
接着剤組成物
Document Type and Number:
Japanese Patent JP7461783
Kind Code:
B2
Abstract:
To provide an adhesive composition which exhibits excellent heat-resistant creep performance and moist heat creep resistance performance even when woody boards and a plastic sheet are bonded in low temperature environment of 5°C or without being blended with an organic solvent such as toluene and xylene.SOLUTION: An adhesive composition contains an ethylene-vinyl acetate copolymer-based resin emulsion (A), an urethane resin emulsion (B), biuret type hexamethylene diisocyanate (C), in which the biuret type hexamethylene diisocyanate (C) is diluted with a solvent that is compatible with water and does not contain alcohol as a functional group.SELECTED DRAWING: None
Inventors:
Takahiro Tsuji
Application Number:
JP2020069956A
Publication Date:
April 04, 2024
Filing Date:
April 08, 2020
Export Citation:
Assignee:
Aica Industry Co., Ltd.
International Classes:
C09J123/08; C09J11/06; C09J131/04; C09J175/04
Domestic Patent References:
| JP2002060712A | ||||
| JP2009155538A | ||||
| JP2008050465A | ||||
| JP2004155997A | ||||
| JP6256749A | ||||
| JP9188862A | ||||
| JP2013508520A |