WAFER POLISHING METHOD AND WAFER POLISHING DEVICE

Title:

WAFER POLISHING METHOD AND WAFER POLISHING DEVICE

Document Type and Number:

Japanese Patent JP2002331453

Kind Code:

A

Abstract:

To provide a polishing method, and a polishing device for restraining excessive polishing of an outer peripheral part of a wafer or flattening the wafer excessively polished in the outer peripheral part of the wafer.

This polishing method polishes the wafer W while adding an abrasive by pressing the wafer W to polishing cloth 15 by holding the wafer W by a holding board 11. A polishing object surface of the wafer is polished in a state of recessing a part of the polishing cloth 15 for surrounding the wafer W by at least 0 mm to 1 mm to the polishing object surface of the wafer W by a ring 4 having an inner diameter larger by 1.0 mm or less than a diameter of the wafer W.

Inventors:

TSUCHIYA TOSHIHIRO
MASUMURA HISASHI
ISHII YU
KIMURA NORIO

Application Number:

JP2001137597A

Publication Date:

November 19, 2002

Filing Date:

May 08, 2001

Export Citation:

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Assignee:

SHINETSU HANDOTAI KK
EBARA CORP

International Classes:

B24B37/005; B24B37/30; B24B37/32; B24B49/16; B32B5/00; H01L21/304; (IPC1-7): B24B37/04; B24B37/00; B32B5/00; H01L21/304

Attorney, Agent or Firm:

Yoshio Arafune (1 person outside)

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