Title:
WAFER HOLDING DEVICE AND HOLDING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2634359
Kind Code:
B2
Abstract:
PURPOSE: To make even the high-speed conveyance of a wafer performable by holding it surely even in a compact processing tank, owing to a simple structure.
CONSTITUTION: This holding device is provided with a pair of holding rods 10, having a guide groove 11 for inserting the outer edge of a wafer 2 in the inner part, contacting with an outer edge in the more lower part than a center line 2a of the wafer 2, and holding this wafer 2 in uplifting it from the downside, and also provided with a pair of chucks 9 installing these paired holding rods 10 approachably and whose wafer holding part is formed into almost rectilinear form, respectively. In addition, it has a guide groove 13 like the holding rod, and the outer edge of the wafer 2 is inserted into this guide groove 13, thereby only guiding the wafer 2 so as not to be toppled, at least one auxiliary rod 12, not energizing the outer edge of the wafer 2 in the center direction, is installed.
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Inventors:
SUGIMOTO KENJI
MAEKAWA NAOTADA
HIROE TOSHIRO
MAEKAWA NAOTADA
HIROE TOSHIRO
Application Number:
JP25399492A
Publication Date:
July 23, 1997
Filing Date:
August 28, 1992
Export Citation:
Assignee:
DAINIPPON SUKURIIN SEIZO KK
International Classes:
B25J15/08; B25J15/10; B65G49/07; H01L21/304; H01L21/677; H01L21/68; (IPC1-7): B25J15/10; B25J15/08; H01L21/68
Domestic Patent References:
| JP63111637A | ||||
| JP59134834A | ||||
| JP290522A |
Attorney, Agent or Firm:
Shigeaki Yoshida (2 outside)
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