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Title:
VAPOR DEPOSITION APPARATUS, AND VAPOR DEPOSITION SOURCE, AND DISPLAY DEVICE MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2007332458
Kind Code:
A
Abstract:

To provide a vapor deposition apparatus applicable to a large substrate and capable of obtaining a vapor-deposited film having a uniform film thickness, and a vapor deposition source used therefor.

A vapor deposition source 10 feeds a vapor deposition substance m substantially in a horizontal direction from a plurality of openings 10A arranged in a line. The vapor deposition source 10 comprises a feed end 11 having the plurality of openings 10A, a raw material feed source 12 for storing and vaporizing the vapor deposition substance m, and a feed pipe 13 for connecting the raw material feed source 12 to the feed end 11 and conveying the vaporized vapor deposition substance m to the feed end 11. The feed pipe 13 is connected to the feed end 11 while at least the feed end 11 side is branched into a plurality of parts, and a flow rate control means 17 is provided on each of the plurality of branched feed pipes 13a. The vapor deposition has the vapor deposition source.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
KANO HIROSHI
UETAKE YUKI
MATSUMOTO HISAKI
TSUCHIYA TAKASHI
SAITO AKIRA
Application Number:
JP2007132786A
Publication Date:
December 27, 2007
Filing Date:
May 18, 2007
Export Citation:
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Assignee:
SONY CORP
International Classes:
C23C14/24; H01L51/50; H05B33/10
Attorney, Agent or Firm:
Funabashi Kuninori